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Intel Server Systems H2300JF Family

Key FeaturesIntel  Server Systems H2300JF Family

  • 12 3.5” hot-swap hard drives
  • Two 1200W Platinum Efficiency common redundant power supplies
  • Hot-swappable 4-node system featuring four Intel® Server Board S2600JF
  • Supports the new Intel® Xeon® processor E5-2600 product family
  • Maximum 32 memory sockets supporting LR/U/R-DIMMs for maximum memory bandwidth up to 1600MHz (eight per board)
  • Pluggable carrier trays with cable-free power for easy serviceability
  • Three high speed 40mm fans per node for individual node level cooling
  • Maximum 12 PCIe* Gen3 x16 slots (three per board)
  • Intel® I/O Expansion Module and Intel® Remote Management Module 4 (Intel® RMM4) supported
  • Models available with or without integrated QDR/FDR Infiniband*
  • Cable-free hot-swap and storage interface options
The Preferred Compute Density Solution for Maximum I/O Capacity and Memory Throughput

The Intel® Server System H2300JF family is specifically designed for the HPC market, a high density, 2U, four-node solution supporting up to eight total Intel® Xeon® processors E5-2600 product family, optional QDR/ FDR InfiniBand* and a total of 32 memory DIMMS at 1600MHz, balancing  optimal memory bandwidth and computing power to maximize price performance. The Intel® Server System H2300JF includes energy efficient power supplies, front control panels and intelligent system level management for overall system and individual node monitoring. The system is also available with Intel® I/O Expansion Modules or Intel® Remote Management Module 4, upgrades available separately.

The Intel® Server System H2300JF family makes use of several key new Intel® Server Board technology innovations. The Intel® Advanced Management Technology helps simplify and optimize system management for higher capacity and more secure platform management. Intel® Quiet Thermal Technology enhancements, including Advanced Thermal Sensor Array and Thermal Trip Shutdown, provide thermal and acoustic management to reduce unnecessary noise and provide cooling flexibility while maximizing system efficiency. This board also makes use of power delivery enhancements from the Intel® Efficient Power Technology, to help improve power efficiency and reliability.

System Order Code

H2312JFJR

H2312JFQJR

Essentials

Limited 3-year warranty

Yes

Yes

Extended warranty available for purchase

Yes

Yes

On-site repair (select countries)

True

True

Chassis form factor

Rack

Rack

Chassis dimensions

3.5'' x 17.2'' x 30.5''

3.5'' x 17.2'' x 30.5''

Socket

Socket R

Socket R

Max CPU configuration

8

8

Rack-friendly board

Yes

Yes

Power supply

1200W common redundant power supply (Platinum efficiency)

1200W common redundant power supply (Platinum efficiency)

Power supply type

AC

AC

# of oower supply

2

2

Redundant fans

No

No

Redundant power

Yes

Yes

Heat sink included

Yes

Yes

Included items

Integrated 2U 4-node server system including 4 Intel® Server Board S2600JF, 4 bridge board, 4 node power board, 4 PCIe* x16 riser card, 8 1U passive 91.5mm x 91.5mm heat sink, (12) 4056 dual rotor fan, 4 air duct, 4 1U node tray, 1 3.5'' SATA/SAS backplane to support 12x 3.5'' hot-swap HDD, 12 3.5" drive carriers, 2 1200W common redundant power supply (Platinum efficiency), 2 power distribution boards, value rails

Integrated 2U 4-node server system including 4 Intel® Server Board S2600JFQ with InfiniBand* QDR (40Gb/s), 4 bridge board, 4 node power board, 4 PCIe* x16 riser card, 8 1U passive 91.5mm x 91.5mm heat sink, 12 4056 dual rotor fan, 4 air duct, 4 1U node tray, 1 3.5'' SATA/SAS backplane to support 12x 3.5'' hot-swap HDD, 12 3.5" drive carriers, 2 1200W common redundant power supply (Platinum efficiency), 2 power distribution boards, value rails

# of 3.5" hard drives

12

12

3.5" hard drive support

Supports 12 hot-swap 3.5" SATA 3G drives standard, SAS 3G with activation key/discrete controller

Supports 12 hot-swap 3.5" SATA 3G drives standard, SAS 3G with activation key/discrete controller

Intel® Server Management Software

Yes

Yes

Memory Specifications

Memory types

DDR3 ECC UDIMM 1333, RDIMM 1600, LRDIMM 1333 LRDIMM

DDR3 ECC UDIMM 1333, RDIMM 1600, LRDIMM 1333 LRDIMM

# of DIMMs

32

32

Graphics Specifications

Integrated graphics

Yes

Yes

Expansion Options

PCIe* x16 Gen 3

4

4

Intel® IO Expansion Module PCIe* x8 Gen 3

4

4

I/O Specifications

# of USB ports

20

20

# of SATA ports

20

20

RAID configuration

Software RAID 1,0,10 optional 5

Software RAID 1,0,10 optional 5

# of serial ports

4

4

Integrated LAN

8x 1GbE

8x 1GbE

# of LAN ports

8

8

Optical drive support

No

No

Integrated SAS ports

12

12

Embedded USB (eUSB) solid state drive Option

No

No

Advanced Technologies

Intel® Remote Management Module Support

True

True

Integrated BMC with IPMI

IPMI 2.0

IPMI 2.0

Intel® Trusted Platform Module (Intel® TPM) Version

2

2

Intel® Intelligent Power Node Manager

Yes

Yes

Intel® On-Demand Redundant Power

Yes

Yes

Intel® Server Board Technology Innovations

Intel® Advanced Management Technology

Yes

Yes

Intel® Efficient Power Technology

Yes

Yes

Intel® Quiet Thermal Technology

Partial

Partial