Specifications
System | Form Factor | 4U Rackmount |
Gross Weight | 29 kg |
Chassis Model | FT72 |
Dimension (D x W x H) | 27.96" x 17.245" x 6.93" (710 x 438 x 176mm) |
Motherboard | S7015GM4NR-LE |
Board Dimension | 16"x19" (406.4x482.6mm) |
Front Panel | Buttons | (1) RST / (1) NMI / (1) ID / (1) PWR w/ LED |
LEDs | (1) PWR / (1) HDD / (1) Warning |
I/O Ports | (2) USB ports |
Internal Drive Bay | Type / Q'ty | (2) 2.5" fixed |
Supported HDD Interface | SATA-II 3.0Gb/s |
System Cooling Configuration | FAN | (3) 12cm fans |
Power Supply | Type | ERP1U |
Efficiency | 80 plus silver |
Serviceability | Hot-swap |
Input Range | 100-127V AC (Low-Line Voltage) / 200-240V AC (High-Line Voltage) |
Frequency | 50/60 Hertz |
Output Watts | 2400W [(2+1) 2400W @200-240V], Max. 12Vdc@ 199.6A / 3000W [3 x1000W @100-127V], Max. 12Vdc@ 249.6A; Note: Only one AC inlet allowed per circuit breaker |
GPU Power Connectors | (4) 2x4-pin & (4) 2x3-pin auxiliary 12V power cables included |
Processor | Supported CPU Series | Intel Xeon Processor 5500/ 5600 Series |
Socket Type / Q'ty | LGA1366 / (2) |
Thermal Design Power (TDP) wattage | Max up to 130W |
System Bus | Up to 4.8/ 5.86/ 6.4GT/s with Intel QuickPath Interconnect (QPI) support |
Chipset | IOH / ICH | Intel 5500 / ICH10R |
Super I/O | Winbond W83627 |
PCI-E Switch | PLX PEX8647 |
Memory | Supported DIMM Qty | (9)+(9) DIMM slots |
DIMM Type / Speed | DDR3/DDR3L 800/1066/1333* RDIMM/UDIMM |
Capacity | Up to 288GB at launch w/ dual rank RDIMMs |
Memory channel | 3 Channels per CPU |
Memory voltage | 1.5V or 1.35V |
Expansion Slots | PCI-E | (4) PCI-E x16 slot ( w/ x16 link from IOHs via PEX8647 switchs) / (2) PCI-E x16 slots (w/ x4 link from IOHs) |
PCI | (1) PCI 32-bit slot |
Max. HBA Dimension (H x L) | (13) 111.15mm x 312.00mm (FH/FL) |
LAN | Port Q'ty | (4) |
Controller | Intel 82574L |
Graphic | Connector type | D-Sub 15-pin |
Resolution | Up to 1600x1200 |
Chipset | Aspeed AST2050 |
I/O Ports | USB | (2) ports |
VGA | (1) D-Sub 15-pin port |
RJ-45 | (4) ports |
System Monitoring | Chipset | Winbond W83793G |
Voltage | Monitors voltage for CPU, memory, chipset & power supply |
Temperature | Monitors temperature for CPU & system environment |
LED | Fan fail LED indicator / Over temperature warning indicator |
Others | Watchdog timer support |
Server Management | Onboard Chipset | Onboard Aspeed AST2050 |
AST2050 IPMI Feature | IPMI 2.0 compliant baseboard management controller (BMC) / USB 2.0 virtual hub / BIOS update |
AST2050 iKVM Feature | 24-bit high quality video compression / Dual 10/100 Mb/s MAC interfaces |
BIOS | Brand / ROM size | AMI / 4MB |
Feature | Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE boot / ACPI 2.0 power management /Power on mode after power recovery / User-configurable H/W monitoring |
Operating System | OS supported list | Please refer to our OS supported list. |
Regulation | FCC (DoC) | Class A |
CE (DoC) | Yes |
Operating Environment | Operating Temp. | 10° C ~ 35° C (50° F~ 95° F) |
Non-operating Temp. | - 40° C ~ 70° C (-40° F ~ 158° F) |
In/Non-operating Humidity | 90%, non-condensing at 35° C |
RoHS | RoHS 6/6 Compliant | Yes |
Package Contains | Barebone | (1) B7015F72V2R-LE Barebone w/(4) NV Telsa M2090 cards pre-installed |
Manual | (1) User's manual |
Installation CD | (1) TYAN installation CD |
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